Sitemap TUCHSCHERER ELEKTRONIK GMBH
TUCHSCHERER Internal
Development
- Analog and Digital Circuits
- High Frequency Circuits
- Power Supplies
- Special Application
- Mechanical Design
- Circuit simulation
- Thermal imaging
- Magnetic field calculation
CAD-Design
Manufacturing
- Printed Circuit Boards
- Assembly SMD
- Assembly THD
- Prototypes to Series
- Purchase of Material
- Assembly Wiring
- Cabinet Wiring
- Special Assembly
- Cable Assembly
- Mechanical Processing
Testing
- Optical Check
- In-Circuit-Test
- Functional Test
- Documentation
- Manufacturing of Test Equipment
- Test Adapter for all Burn-In Sockets
- Machinery
Printed Circuit Bords
- Single and Multilayer up to 30 Layer
- Fine Trace Width down to 30µm
- Mechanical Drilling 100µm
- Blind Vias - Micro Vias
- Plugging (BGA, µmBGA)
- All established Surfaces
- All established Materials
