TUCHSCHERER ELEKTRONIK GMBH
Burn-IN Boards
for Semiconductor Industry
Development
Analog and Digital Circuits
High Frequency Circuits
Power Supplies
Special Application
Mechanical Design
Circuit simulation
Thermal imaging
Magnetic field calculation
CAD-Design
CAD-Layout
CAD-Systems
Requirements and Formats
Documents
Manufacturing
Printed Circuit Boards
Assembly SMD
Assembly THD
Prototypes to Series
Purchase of Material
Assembly Wiring
Cabinet Wiring
Special Assembly
Cable Assembly
Mechanical Processing
Testing
Optical Check
In-Circuit-Test
Functional Test
Documentation
Manufacturing of Test Equipment
Test Adapter for all Burn-In Sockets
Machinery
Printed Circuit Bords
Single and Multilayer up to 30 Layer
Fine Trace Width down to 30µm
Mechanical Drilling 100µm
Blind Vias - Micro Vias
Plugging (BGA, µmBGA)
All established Surfaces
All established Materials
CAD-Systems
Following systems are used:
PAD´S Power PCB (Mentor Graphics)
PADS 2004 (Mentor Graphics)
Eagle (Cad Soft)
TOPCAD (Spea)
MICAD (Micron)
Board for Semiconductor Test Equipment
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